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MC74LCX138 Low-Voltage CMOS 3-to-8 Decoder/Demultiplexer
With 5 V-Tolerant Inputs
T h e M C 7 4 L C X 1 3 8 i s a h i g h p e r f o r m a n c e , 3 -t o -8 decoder/demultiplexer operating from a 2.3 to 3.6 V supply. High impedance TTL compatible inputs significantly reduce current loading to input drivers while TTL compatible outputs offer improved switching noise performance. A VI specification of 5.5 V allows MC74LCX138 inputs to be safely driven from 5 V devices. The MC74LCX138 is suitable for memory address decoding and other TTL level bus-oriented applications. The MC74LCX138 high-speed 3-to-8 decoder/demultiplexer accepts three binary weighted inputs (A0, A1, A2) and, when enabled, provides eight mutually exclusive active-LOW outputs (O0-O7). The LCX138 features three Enable inputs, two active-LOW (E1, E2) and one active-HIGH (E3). All outputs will be HIGH unless E1 and E2 are LOW, and E3 is HIGH. This multiple enabled function allows easy parallel expansion of the device to a 1-of-32 (5 lines to 32 lines) decoder with just four LCX138 devices and one inverter (see Figure 1). The LCX138 can be used as an 8-output demultiplexer by using one of the active-LOW Enable inputs as the data input and the other Enable inputs as strobes. The Enable inputs which are not used must be permanently tied to their appropriate active-HIGH or active-LOW state. Current drive capability is 24 mA at the outputs.
Features http://onsemi.com MARKING DIAGRAMS
16 SOIC-16 D SUFFIX CASE 751B 1 16 LCX138 AWLYWW
16 1
16 1
TSSOP-16 DT SUFFIX CASE 948F
LCX 138 ALYW
1 16 SOEIAJ-16 M SUFFIX CASE 966 1 1 A L, WL Y W, WW = = = = Assembly Location Wafer Lot Year Work Week 74LCX138 ALYW
16
* * * * * *
Designed for 2.3 V to 3.6 V VCC Operation 5 V Tolerant Inputs - Interface Capability With 5 V TTL Logic LVTTL Compatible LVCMOS Compatible 24 mA Balanced Output Sink and Source Capability Near Zero Static Supply Current (10 mA) Substantially Reduces System Power Requirements Latchup Performance Exceeds 500 mA Human Body Model >2000 V Machine Model >200 V Pb-Free Packages are Available*
* * ESD Performance: *
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 3 of this data sheet.
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
(c) Semiconductor Components Industries, LLC, 2005
1
January, 2005 - Rev. 5
Publication Order Number: MC74LCX138/D
MC74LCX138
A2 3 VCC 16 A1 2 A0 1 E1 4 E2 5 E3 6
O0 15
O1 14
O2 13
O3 12
O4 11
O5 10
O6 9
1 A0
2 A1
3 A2
4 E1
5 E2
6 E3
7
8
O7 GND
Figure 1. Pinout: 16-Lead (Top View)
7 O7 9 O6 1 O50 1 O41 12 O3 13 O2 1 O14 1 O05
Figure 2. Logic Diagram PIN NAMES
Pins A0-A2 E1-E2 E3 O0-O7 Function Address Inputs Enable Inputs Enable Input Outputs
TRUTH TABLE
Inputs E1 H X X L L L L E2 X H X L L L L E3 X X L H H H H A0 X X X L H L H A1 X X X L L H H A2 X X X L L L L O0 H H H L H H H H H H H O1 H H H H L H H H H H H O2 H H H H H L H H H H H Outputs O3 H H H H H H L H H H H O4 H H H H H H H L H H H O5 H H H H H H H H L H H O6 H H H H H H H H H L H O7 H H H H H H H H H H L
L L H L L H L L H H L H L L H L H H L L H H H H H = High Voltage Level L = Low Voltage Level X = High or Low Voltage Level and Transitions are Acceptable For ICC reasons, DO NOT FLOAT Inputs
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MC74LCX138
A0 A1 A2 A3 A4 H 123 A0 A1 A2 E A0 A1 A2
`04
123 E A0 A1 A2
123 E A0 A1 A2
123 E
O0 O1 O2 O3 O4 O5 O6 O7
O0 O1 O2 O3 O4 O5 O6 O7
O0 O1 O2 O3 O4 O5 O6 O7
O0 O1 O2 O3 O4 O5 O6 O7
O0
O31
Figure 3. Expansion to 1-of-32 Decoding
ORDERING INFORMATION
Device MC74LCX138DR2 MC74LCX138DR2G MC74LCX138DT MC74LCX138DTR2 MC74LCX138MEL Package SOIC-16 SOIC-16 (Pb-Free) TSSOP-16* TSSOP-16* SOEIAJ-16 Shipping 2500 Tape & Reel 2500 Tape & Reel 96 Units / Rail 2500 Tape & Reel 2000 Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb-Free.
MAXIMUM RATINGS
Symbol VCC VI VO IIK IOK Parameter DC Supply Voltage DC Input Voltage DC Output Voltage DC Input Diode Current DC Output Diode Current Value -0.5 to +7.0 -0.5 VI +7.0 -0.5 VO VCC + 0.5 -50 -50 +50 IO ICC IGND TSTG DC Output Source/Sink Current DC Supply Current Per Supply Pin DC Ground Current Per Ground Pin Storage Temperature Range 50 100 100 -65 to +150 Output in HIGH or LOW State (Note 1) VI < GND VO < GND VO > VCC Condition Unit V V V mA mA mA mA mA mA C
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. IO absolute maximum rating must be observed.
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MC74LCX138
RECOMMENDED OPERATING CONDITIONS
Symbol VCC VI VO IOH Supply Voltage Input Voltage Output Voltage HIGH Level Output Current (HIGH or LOW State) (3-State) VCC = 3.0 V - 3.6 V VCC = 2.7 V - 3.0 V VCC = 2.3 V - 2.7 V VCC = 3.0 V - 3.6 V VCC = 2.7 V - 3.0 V VCC = 2.3 V - 2.7 V -40 0 Parameter Operating Data Retention Only Min 2.0 1.5 0 0 Typ 2.5, 3.3 2.5, 3.3 Max 3.6 3.6 5.5 VCC -24 -12 -8 +24 +12 +8 +85 10 Unit V V V mA
IOL
LOW Level Output Voltage
mA
TA Dt/DV
Operating Free-Air Temperature Input Transition Rise or Fall Rate, VIN from 0.8 V to 2.0 V, VCC = 3.0 V
C ns/V
DC ELECTRICAL CHARACTERISTICS
TA = -40C to +85C Symbol VIH VIL VOH Characteristic HIGH Level Input Voltage (Note 2) LOW Level Input Voltage (Note 2) HIGH Level Output Voltage Condition 2.3 V VCC 2.7 V 2.7 V VCC 3.6 V 2.3 V VCC 2.7 V 2.7 V VCC 3.6 V 2.3 V VCC 3.6 V; IOH = -100 mA VCC = 2.3 V; IOH = -8 mA VCC = 2.7 V; IOH = -12 mA VCC = 3.0 V; IOH = -18 mA VCC = 3.0 V; IOH = -24 mA VOL LOW Level Output Voltage 2.3 V VCC 3.6 V; IOL = 100 mA VCC = 2.3 V; IOL = 8 mA VCC = 2.7 V; IOL = 12 mA VCC = 3.0 V; IOL = 16 mA VCC = 3.0 V; IOL = 24 mA II ICC Input Leakage Current Quiescent Supply Current 2.3 V VCC 3.6 V; 0 V VI 5.5 V 2.3 VCC 3.6 V; VI = GND or VCC 2.3 VCC 3.6 V; 3.6 VI or VO 5.5 V DICC Increase in ICC per Input 2.3 VCC 3.6 V; VIH = VCC - 0.6 V 2. These values of VI are used to test DC electrical characteristics only. VCC - 0.2 1.8 2.2 2.4 2.2 0.2 0.6 0.4 0.4 0.55 5 10 10 500 mA mA mA V Min 1.7 2.0 0.7 0.8 V V Max Unit V
AC CHARACTERISTICS tR = tF = 2.5 ns; RL = 500 W
Limits TA = -40C to +85C VCC = 3.3 V 0.3 V CL = 50 pF Symbol tPLH tPHL tPLH tPHL tPLH tPHL tOSHL tOSLH Parameter Propagation Delay An to On Propagation Delay E1, E2 to On Propagation Delay E3 to On Output-to-Output Skew (Note 3) Waveform 1, 2 2 1 Min 1.5 1.5 1.5 1.5 1.5 1.5 Max 6.0 6.0 6.5 6.5 6.0 6.0 1.0 1.0 VCC = 2.7 V CL = 50 pF Min 1.5 1.5 1.5 1.5 1.5 1.5 Max 7.0 7.0 7.5 7.5 7.0 7.0 VCC = 2.5 V 0.2 V CL = 30 pF Min 1.5 1.5 1.5 1.5 1.5 1.5 Max 7.2 7.2 8.4 8.4 7.2 7.2 Unit ns ns ns ns
3. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The specification applies to any outputs switching in the same direction, either HIGH-to-LOW (tOSHL) or LOW-to-HIGH (tOSLH); parameter guaranteed by design.
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MC74LCX138
CAPACITIVE CHARACTERISTICS
Symbol CIN COUT CPD Parameter Input Capacitance Output Capacitance Power Dissipation Capacitance Condition VCC = 3.3 V, VI = 0 V or VCC VCC = 3.3 V, VI = 0 V or VCC 10 MHz, VCC = 3.3 V, VI = 0 V or VCC Typical 7 8 25 Unit pF pF pF
VCC An, E3 Vmi Vmi 0V tPHL tPLH VOH On Vmo Vmo VOL WAVEFORM 1: PROPAGATION DELAYS FOR INVERTING OUTPUTS
2.7 V An, E1, E2 Vmi Vmi 0V tPHL On tPLH VOH Vmo Vmo VOL WAVEFORM 2: PROPAGATION DELAYS FOR NON-INVERTING OUTPUTS
Vcc Symbol Vmi Vmo 3.3 V + 0.3 V 1.5 V 1.5 V 2.7 V 1.5 V 1.5 V 2.5 V + 0.2 V Vcc/2 Vcc/2
Figure 4. AC Waveforms
VCC
PULSE GENERATOR RT
DUT CL RL
CL = CL = RL = RT =
50 pF at VCC = 3.3 + 0.3 V or equivalent (includes jig and probe capacitance) 30 pF at VCC = 2.5 + 0.2 V or equivalent (includes jig and probe capacitance) R1 = 500 W or equivalent ZOUT of pulse generator (typically 50 W)
Figure 5. Test Circuit
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MC74LCX138
PACKAGE DIMENSIONS
SOIC-16 D SUFFIX CASE 751B-05 ISSUE J
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. DIM A B C D F G J K M P R MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.229 0.244 0.010 0.019
-A-
16 9
-B-
1 8
P
8 PL
0.25 (0.010)
M
B
S
G F
K C -T-
SEATING PLANE
R
X 45 _
M D
16 PL M
J
0.25 (0.010)
TB
S
A
S
TSSOP-16 DT SUFFIX CASE 948F-01 ISSUE O
16X K REF NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. DIM A B C D F G H J J1 K K1 L M MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 --- 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.18 0.28 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.193 0.200 0.169 0.177 --- 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.007 0.011 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_
0.10 (0.004) 0.15 (0.006) T U
S
M
TU
S
V
S
K K1
16
2X
L/2
9
J1 B -U-
L
PIN 1 IDENT. 1 8
SECTION N-N J
N 0.15 (0.006) T U
S
0.25 (0.010) M
A -V- N F DETAIL E
C 0.10 (0.004) -T- SEATING
PLANE
H D G
DETAIL E
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EE CC EE CC
-W-
MC74LCX138
PACKAGE DIMENSIONS
SOEIAJ-16 M SUFFIX CASE 966-01 ISSUE O
16
9
LE Q1 E HE M_ L DETAIL P
1
8
Z D e A VIEW P
c
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). DIM A A1 b c D E e HE L LE M Q1 Z MILLIMETERS MIN MAX --- 2.05 0.05 0.20 0.35 0.50 0.18 0.27 9.90 10.50 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 _ 0_ 0.70 0.90 --- 0.78 INCHES MIN MAX --- 0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.390 0.413 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 _ 0_ 0.028 0.035 --- 0.031
b 0.13 (0.005)
M
A1 0.10 (0.004)
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MC74LCX138
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MC74LCX138/D

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